THEORETICAL AND EXPERIMENTAL STUDY OF THE ROLL BONDING BEHAVIOR OF BILAYERS AL LAMINATES

Aisha Kamal Mahmoud (), M. Abdulfadhil Gatea (), Taif Alawsi (), A. K. Kareem (), M. Heydari Vini and S. Daneshmand
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Aisha Kamal Mahmoud: Medical Laboratories Technique Department, Al-Nisour University College, Baghdad, Iraq
M. Abdulfadhil Gatea: ��Technical Engineering Department, College of Technical Engineering, The Islamic University, Najaf, Iraq
Taif Alawsi: ��Scientific Research Center, Al-Ayen University, Thi-Qar, Iraq
A. K. Kareem: �Biomedical Engineering Department, Al-Mustaqbal University College, Babylon, Iraq
M. Heydari Vini: �Department of Mechanical Engineering, Mobarakeh Branch, Islamic Azad University, Isfahan, Iran
S. Daneshmand: ��Department of Mechanical Engineering, Majlesi Branch, Islamic Azad University, Majlesi, Isfahan, Iran

Surface Review and Letters (SRL), 2023, vol. 30, issue 03, 1-8

Abstract: In recent years, bimetallic strips have been progressively used in manufacturing to make collective purposes. Amongst cladding approaches, the rolling process is one of the most popular processes in making bimetallic strips. In this study, a new analytical model based on the slab method has been proposed to predict the bond strength of two layer strips. Results show that the bond strength of strips increases with increasing total rolling thickness reduction of the samples. Also, the finite element simulation and an experimental study were run to approve the results obtained from the new analytical model for producing AA1060/AA7075 bimetallic strips. Moreover, the planned analytical model is appropriate for modeling the roll bonding process of the two-layer strips and it is proficient to extend our information in engineering and production of bimetal strips. The bonding strength of bilayer samples enhanced by increasing the reduction in thickness ratio. The peeled surface of samples has been investigated using scanning electron microscopy (SEM).

Keywords: Roll bonding; slab method; bilayer strip; aluminum (search for similar items in EconPapers)
Date: 2023
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DOI: 10.1142/S0218625X23500178

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