Identification of Defects Causes: Ishikawa Diagram and 5 Whys in Theoretical and Practical Terms

Barbara Ciecinska

A chapter in Quality Control and Quality Assurance - Techniques and Applications from IntechOpen

Abstract: The chapter briefly presents the issue of quality and its management in production. In the relevant part of the chapter, the Ishikawa diagram, its variations, and the possibility of extending its application to new areas will be discussed. Similarly, the 5 Whys method is presented. The application of the Ishikawa diagram and how to use the 5 WHYS method are presented with practical examples, enabling them to be transferred to the operation of real enterprises. These examples concern machining, laser processing, and gluing in the context of defective products and processes. The discussion includes case studies of what defects may appear in this type of (or similar, in the field of mechanical engineering) processes, a discussion of their importance in production. Ways to improve machining and assembly operations in the presented context are shown.

Keywords: Ishikawa diagram; 5 Whys; machining; laser processing; bonding (search for similar items in EconPapers)
JEL-codes: L15 (search for similar items in EconPapers)
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Persistent link: https://EconPapers.repec.org/RePEc:ito:pchaps:318794

DOI: 10.5772/intechopen.113990

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