Thermal Stress Analysis of an Elliptic Inclusion with Imperfect Interface Embedded in an Infinite Elastic Medium

Hongnian Shen, Peter Schiavone, Ching Q. Ru and Andrew Mioduchowski

Chapter 36 in Integral Methods in Science and Engineering, 2002, pp 227-231 from Springer

Abstract: Abstract Stresses induced by thermal mismatch are known to be a major cause of failure in a wide variety of composite materials and devices ranging from metal-ceramic composites to passivated interconnect lines in integrated circuits. One of the most effective procedures used to reduce these thermal stresses is the addition of a compliant intermediate or interphase layer between the different material components. In this chapter, we use the homogeneously imperfect interface model [1] to study the effect of a compliant interphase layer on thermal stresses in an elliptic elastic inclusion embedded within an infinite matrix under a uniform change in temperature. Both elastic mismatch and thermal mismatch will be considered.

Date: 2002
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DOI: 10.1007/978-1-4612-0111-3_36

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