Effect of Imperfect Interface on a Thermal Inclusion with an Interior Radial Crack

William Amenyah

Chapter 5 in Integral Methods in Science and Engineering, 2002, pp 33-38 from Springer

Abstract: Abstract In electronic packaging and in the manufacture of fiber-reinforced composites, failure due to fiber cracking caused by thermal mismatch residual stresses is of major concern. Thermal stresses are caused by thermal mismatch between the inclusion and the surrounding matrix due to a uniform change in temperature. Most of the previous works in the area of interaction between a crack and an inclusion have assumed a perfect interface (see, for example, [1]–[4] and [5]). However, in practical problems it is known that the bond between fibers and the matrix material is often imperfect.

Keywords: Stress Intensity Factor; Singular Integral Equation; Electronic Packaging; Radial Crack; Circular Inclusion (search for similar items in EconPapers)
Date: 2002
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DOI: 10.1007/978-1-4612-0111-3_5

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