Technology Overload

Jesko von Windheim ()
Additional contact information
Jesko von Windheim: Duke University

A chapter in The Startup, 2020, pp 53-64 from Springer

Abstract: Abstract Even as solder bumping became my most pressing assignment, it was not my only one. As much as Shelby wanted me to support the solder bumping group, he was most excited about another MCNC innovation: an electromechanical microrelay.

Date: 2020
References: Add references at CitEc
Citations:

There are no downloads for this item, see the EconPapers FAQ for hints about obtaining it.

Related works:
This item may be available elsewhere in EconPapers: Search for items with the same title.

Export reference: BibTeX RIS (EndNote, ProCite, RefMan) HTML/Text

Persistent link: https://EconPapers.repec.org/RePEc:spr:sprchp:978-3-030-45078-6_7

Ordering information: This item can be ordered from
http://www.springer.com/9783030450786

DOI: 10.1007/978-3-030-45078-6_7

Access Statistics for this chapter

More chapters in Springer Books from Springer
Bibliographic data for series maintained by Sonal Shukla () and Springer Nature Abstracting and Indexing ().