Breakdown of Thin-Film Dielectrics
James U. Gleaton (),
David Han,
James D. Lynch,
Hon Keung Tony Ng and
Fabrizio Ruggeri
Additional contact information
David Han: University of Texas at San Antonio, Management of Science and Statistics
James D. Lynch: University of South Carolina, Department of Statistics
Hon Keung Tony Ng: Bentley University, Department of Mathematical Sciences
Fabrizio Ruggeri: Consiglio Nazionale delle Ricerche, Istituto di Matematica Applicata e Tecnologie Informatiche
Chapter Chapter 3 in Fiber Bundles, 2022, pp 39-52 from Springer
Abstract:
Abstract We are considering the breakdown mechanisms of a thin-film dielectric. The earlier type of dielectric used in electronic circuits, silicon dioxide, is generated on a metal substrate by a chemical vapor deposition process (Chu, 2014). The deposition process is usually performed at relatively low temperatures to avoid defect formation, diffusion, and degradation of the metal layers.
Date: 2022
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Persistent link: https://EconPapers.repec.org/RePEc:spr:sprchp:978-3-031-14797-5_3
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DOI: 10.1007/978-3-031-14797-5_3
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