Enhancement of heat dissipation in an electronic chip cooling system using graphite fins

Dong Xue, Long Wu and Lian Xun

MPRA Paper from University Library of Munich, Germany

Abstract: As electronic devices get smaller, cooling systems with higher thermal efficiency is demanding by fast growing electronic industry. Great amount of research has been performed on the cooling systems but research on the materials of the cooling systems needs more work. Graphite with high thermal conductivity and light weight is a great candidate to be used in electronic devices. The bottleneck of using graphene in the cooling systems is the thermal transport among the interface from the substrate to the graphene fin system. In this research finite element simulation of graphite fin cooling system has been investigated to study the effect of different applied pressure on the cooling system performance. Study of this cooling system showed good improvement in comparison with common copper fin cooling systems.

Keywords: Tesla microvalve; diodicity; pressure field, velocity field; thermal management (search for similar items in EconPapers)
JEL-codes: I0 (search for similar items in EconPapers)
Date: 2017-04-03, Revised 2017-06-28
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Persistent link: https://EconPapers.repec.org/RePEc:pra:mprapa:80061

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