Experimental and numerical study on thermal management performance of PCM-based heat sinks with various configurations fabricated by additive manufacturing

Xusheng Hu, Pengyun Chen, Xiaoxia Zhang, Xiaolu Gong, Yufeng Shuai, Yupeng Wang, Xiaodong Xing, Xin Zheng and Guantong Wang

Renewable Energy, 2024, vol. 232, issue C

Abstract: Due to the low thermal conductivity of PCM, the enhancement of thermal performance becomes a crucial issue for the application of PCM-based heat sinks in electronic device cooling. To address this, efficient and integrative PCM-based heat sinks using fin and structured porous material (SPM) are designed and fabricated by additive manufacturing (AM). This work aims to investigate thermal performance of PCM-based heat sinks and the role of fin and SPM used as thermal conductivity enhancers (TCEs). The enhanced heat transfer mechanisms in PCM-based heat sinks using different types of TCEs are determined, and parametric analysis is conducted considering various volume fractions of TCEs (10 %, 15 %, and 20 %). Moreover, the effects of heating power levels and convective heat transfer coefficients on thermal behavior of PCM-based heat sink are analyzed. The results indicate that incorporating SPM in heat sink enhances thermal performance more effectively than using fins for an equivalent TCE fraction. Both heating power and convective heat transfer coefficient have a significant on thermal performance. This research demonstrates the potential of the novel heat sink with SPM in cooling electronic devices and provides the experimental and numerical database for the optimal design and future application of PCM-based heat sink.

Keywords: Phase change material (PCM); Additive manufacturing (AM); Structured porous material (SPM); Fin; Thermal performance (search for similar items in EconPapers)
Date: 2024
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Citations: View citations in EconPapers (1)

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Persistent link: https://EconPapers.repec.org/RePEc:eee:renene:v:232:y:2024:i:c:s0960148124011376

DOI: 10.1016/j.renene.2024.121069

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