EconPapers    
Economics at your fingertips  
 

Limits to Modularity: A Review of the Literature and Evidence from Chip Design

Dieter Ernst

No 71, Economics Study Area Working Papers from East-West Center, Economics Study Area

Abstract: This working paper has been prepared as part of the East-West Center's research project on Globalization of Knowledge Work: Why is Chip Design Moving to Asia. In this paper, Dieter assesses what we know about the limits to modularity and their impact on firm organization and industry structure. He focuses on evidence form chip design, drawing on interview on 2002 and 2003 with a sample of 60 companies and 15 research institutions that are involved in chip design in the US, Taiwan, Korea, China and Malaysia. It is summarized "stylized" propositions of the modularity literature that are well-established, as well as predictions that are controversial. In addition, important limits to modularity and relevant management responses were reviewed.

Pages: 25 pages
Date: 2004-09
New Economics Papers: this item is included in nep-ino
References: View complete reference list from CitEc
Citations: View citations in EconPapers (3)

Downloads: (external link)
http://www.eastwestcenter.org/fileadmin/stored/pdfs/ECONwp071.pdf (application/pdf)
Our link check indicates that this URL is bad, the error code is: 404 Not Found (http://www.eastwestcenter.org/fileadmin/stored/pdfs/ECONwp071.pdf [301 Moved Permanently]--> https://www.eastwestcenter.org/fileadmin/stored/pdfs/ECONwp071.pdf)

Related works:
This item may be available elsewhere in EconPapers: Search for items with the same title.

Export reference: BibTeX RIS (EndNote, ProCite, RefMan) HTML/Text

Persistent link: https://EconPapers.repec.org/RePEc:ewc:wpaper:wp71

Access Statistics for this paper

More papers in Economics Study Area Working Papers from East-West Center, Economics Study Area Contact information at EDIRC.
Bibliographic data for series maintained by Brenda Higashimoto ( this e-mail address is bad, please contact ).

 
Page updated 2025-03-30
Handle: RePEc:ewc:wpaper:wp71