Numerical and Experimental Study on the Heat Dissipation Performance of a Novel System

Cairui Yu, Dongmei Shen, Qingyang Jiang, Wei He, Hancheng Yu, Zhongting Hu, Hongbing Chen, Pengkun Yu and Sheng Zhang
Additional contact information
Cairui Yu: Department of Building Environment and Equipment, Hefei University of Technology, Hefei 230009, China
Dongmei Shen: Department of Architecture and Civil Engineering, West Anhui University, Lu’an 237012, China
Qingyang Jiang: College of Civil Engineering and Architecture, Jiaxing University, Jiaxing 314001, China
Wei He: Department of Building Environment and Equipment, Hefei University of Technology, Hefei 230009, China
Hancheng Yu: Qinghai College of Architectural Technology, Xining 810002, China
Zhongting Hu: Department of Building Environment and Equipment, Hefei University of Technology, Hefei 230009, China
Hongbing Chen: School of Environment and Energy Engineering, Beijing University of Civil Engineering and Architecture, Beijing 100044, China
Pengkun Yu: Department of Building Environment and Equipment, Hefei University of Technology, Hefei 230009, China
Sheng Zhang: Department of Building Environment and Equipment, Hefei University of Technology, Hefei 230009, China

Energies, 2019, vol. 13, issue 1, 1-26

Abstract: In order to better release the heat generated by the electronic components, a novel heat dissipation system is proposed, which combines a microchannel heat pipe (MHP) with a high thermal conductivity and a radiative plate with a high emissivity at nighttime. First, a simple testing rig was made with an MHP and a radiative plate, where the radiative plate was made of acrylic resin, a curing agent, thinner, and aluminum plate, and had strong radiative cooling at nighttime. Second, the mathematical model was initially established and verified using experiments, where it was shown that the agreement between numerical and experimental data was well within experimental uncertainties. Comprehensive simulation investigations were conducted by varying wind speed, relative humidity, the cloudiness coefficient, dimension of the radiative plate, and tilted angle. The results show that: (1) the emissivity of the radiative plate was about 0.311 in the daytime and about 0.908 in the nighttime; (2) the influence of wind speed on reducing the component surface temperature was greater than the cloudiness coefficient and relative humidity; (3) the width of the radiative plate had a greater effect on heat dissipation than on its length, and the maximum size of radiative plate was recommended to be 400 mm × 400–500 mm (length × width), which was equipped with a single MHP (width: 60 mm). Additionally, the tilted angle of the radiative plate should be kept within 30° of the horizontal level. In conclusion, the novel heat dissipation system had a superior application value for providing assisted electronic component cooling in the nighttime.

Keywords: electronic cooling; microchannel pipe; radiative cooling; numerical study (search for similar items in EconPapers)
JEL-codes: Q Q0 Q4 Q40 Q41 Q42 Q43 Q47 Q48 Q49 (search for similar items in EconPapers)
Date: 2019
References: View references in EconPapers View complete reference list from CitEc
Citations: View citations in EconPapers (7)

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