Non-Contact Degradation Evaluation for IGBT Modules Using Eddy Current Pulsed Thermography Approach

Xingliang Liu, Guiyun Tian, Yu Chen, Haoze Luo, Jian Zhang and Wuhua Li
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Xingliang Liu: College of Electrical Engineering, Zhejiang University, Hangzhou 310027, China
Guiyun Tian: College of Electrical and Electronic Engineering, Newcastle University, Newcastle upon Tyne NE1 7RU, UK
Yu Chen: College of Electrical Engineering, Zhejiang University, Hangzhou 310027, China
Haoze Luo: College of Electrical Engineering, Zhejiang University, Hangzhou 310027, China
Jian Zhang: College of Electrical Engineering, Zhejiang University, Hangzhou 310027, China
Wuhua Li: College of Electrical Engineering, Zhejiang University, Hangzhou 310027, China

Energies, 2020, vol. 13, issue 10, 1-14

Abstract: In this paper, a non-contact degradation evaluation method for insulated gate bipolar transistor (IGBT) modules is proposed based on eddy current pulsed thermography approach. In non-contact heat excitation procedures, a high-power induction heater is introduced to generate heat excitation in IGBT modules. The thermographs of the whole temperature mapping are recorded non-invasively by an IR camera. As a result, the joint degradation of IGBT modules can be evaluated by the transient thermal response curves derived from the recorded thermographs. Firstly, the non-destructive evaluation principle of the eddy current pulsed thermography (ECPT) system for an IGBT module with a heat sink is introduced. A 3D simulation module is built with physical parameters in ANSYS simulations, and then thermal propagation behavior considering the degradation impact is investigated. An experimental ECPT system is set up to verify the effectiveness of the proposed method. The experimental results show that the delay time to peak temperature can be extracted and treated as an effective indicative feature of joint degradation.

Keywords: eddy current pulsed thermography (ECPT); joint degradation; non-contact evaluation; transient thermal response curves (search for similar items in EconPapers)
JEL-codes: Q Q0 Q4 Q40 Q41 Q42 Q43 Q47 Q48 Q49 (search for similar items in EconPapers)
Date: 2020
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