Methods for the Separation of Failure Modes in Power-Cycling Tests of High-Power Transistor Modules Using Accurate Voltage Monitoring

Zoltan Sarkany and Marta Rencz
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Zoltan Sarkany: Mentor, a Siemens Business Mechanical Analysis Division, Gábor Dénes utca 2, 1117 Budapest, Hungary
Marta Rencz: Mentor, a Siemens Business Mechanical Analysis Division, Gábor Dénes utca 2, 1117 Budapest, Hungary

Energies, 2020, vol. 13, issue 11, 1-18

Abstract: The accurate measurement of on-state device voltage during power-cycling tests can deliver important information about the health of the tested power electronics components. In this article, we present the major aspects of how a power-cycling test can be set up to enable high-resolution device voltage monitoring, during both heating and cooling stages, and discuss the effect of some important parameters on the arising failure modes. The thermal transient of the component can also be captured in these setups. We show how the structure functions calculated from the captured thermal transients can be used to reveal the location of degradation in the module structure. Finally, the method for identification of bond-wire cracking and lift-off using only the measured voltage curves, is shown.

Keywords: power cycling; thermal transient testing; bond-wire degradation; die-attach degradation (search for similar items in EconPapers)
JEL-codes: Q Q0 Q4 Q40 Q41 Q42 Q43 Q47 Q48 Q49 (search for similar items in EconPapers)
Date: 2020
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