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TRIC: A Thermal Resistance and Impedance Calculator for Electronic Packages

Lorenzo Codecasa, Francesca De Viti, Vincenzo d’Alessandro, Donata Gualandris, Arianna Morelli and Claudio Maria Villa
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Lorenzo Codecasa: Department of Electronics, Information and Bioengineering, Politecnico di Milano, 20133 Milan, Italy
Francesca De Viti: STMicroelectronics, 20864 Agrate Brianza, Italy
Vincenzo d’Alessandro: Department of Electrical Engineering and Information Technology, University Federico II, 80125 Naples, Italy
Donata Gualandris: STMicroelectronics, 20864 Agrate Brianza, Italy
Arianna Morelli: STMicroelectronics, 20864 Agrate Brianza, Italy
Claudio Maria Villa: STMicroelectronics, 20864 Agrate Brianza, Italy

Energies, 2020, vol. 13, issue 9, 1-16

Abstract: This paper presents the Thermal Resistance and Impedance Calculator (TRIC) tool devised for the automatic extraction of thermal metrics of package families of electronic components in both static and transient conditions. TRIC relies on a solution algorithm based on a novel projection-based approach, which—unlike previous techniques—allows (i) dealing with parametric detailed thermal models (pDTMs) of package families that exhibit generic non-Manhattan variations of geometries and meshes, and (ii) transforming such pDTMs into compact thermal models that can be solved in short times. Thermal models of several package families are available, and dies with multiple active areas can be handled. It is shown that transient thermal responses of chosen packages can be obtained in a CPU (central processing unit) time much shorter than that required by a widely used software relying on the finite-volume method without sacrificing accuracy.

Keywords: electronic packages; detailed thermal model; Joint Electron Device Engineering Council (JEDEC) metrics; thermal impedance; thermal simulation (search for similar items in EconPapers)
JEL-codes: Q Q0 Q4 Q40 Q41 Q42 Q43 Q47 Q48 Q49 (search for similar items in EconPapers)
Date: 2020
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