Thermal Draft Load Coefficient for Heating Load Differences Caused by Stack-Driven Infiltration by Floor in Multifamily High-Rise Buildings
Juhyun Bak,
Jabeom Koo,
Sungmin Yoon and
Hyunwoo Lim
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Juhyun Bak: Division of Architecture and Urban Design, Incheon National University, Incheon 22012, Korea
Jabeom Koo: Division of Architecture and Urban Design, Incheon National University, Incheon 22012, Korea
Sungmin Yoon: Division of Architecture and Urban Design, Incheon National University, Incheon 22012, Korea
Hyunwoo Lim: College of Architecture, Konkuk University, Seoul 05029, Korea
Energies, 2022, vol. 15, issue 4, 1-21
Abstract:
The stack effect is dominant in multifamily high-rise buildings (MFHRBs) in winter because of the considerable height of MFHRBs, which causes a difference in the infiltration amount between floors. This difference causes a heating load difference between floors in a MFHRB. However, there are no indicators to quantify the heating load differences in previous studies. In this article, an indicator—the thermal draft load coefficient (TDLC)—is proposed that can be used to estimate and evaluate the differences between floors in a MFHRB. The TDLC is built on a theoretical model of the stack effect and leakage area of the airflow paths, considering the entire building airflow in a MFHRB. The theoretical model was validated by comparison with a simulation model. The winter average coefficient of variation of the root mean square error and the normalized mean bias error of the theoretical model were acceptable (17.1% and 9.3%, respectively). The TDLC resulted in a maximum of 2.5 and a minimum of approximately 0.1 in the target MFHRB. The TDLC can pre-evaluate the load difference in the building design stage and can be utilized to build design standards or guidelines.
Keywords: thermal draft load coefficient; stack effect; infiltration; heating load; multifamily high-rise buildings (search for similar items in EconPapers)
JEL-codes: Q Q0 Q4 Q40 Q41 Q42 Q43 Q47 Q48 Q49 (search for similar items in EconPapers)
Date: 2022
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