Exploring the Technological Collaboration Characteristics of the Global Integrated Circuit Manufacturing Industry

Yun Liu, Zhe Yan, Yijie Cheng and Xuanting Ye
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Yun Liu: School of Management and Economics, Beijing Institute of Technology, Beijing 100081, China
Zhe Yan: School of Management and Economics, Beijing Institute of Technology, Beijing 100081, China
Yijie Cheng: School of Management and Economics, Beijing Institute of Technology, Beijing 100081, China
Xuanting Ye: School of Management and Economics, Beijing Institute of Technology, Beijing 100081, China

Sustainability, 2018, vol. 10, issue 1, 1-23

Abstract: With the intensification of international competition, there are many international technological collaborations in the integrated circuit manufacturing (ICM) industry. The importance of improving the level of international technological collaboration is becoming more and more prominent. Therefore, it is vital for a country, a region, or an institution to understand the international technological collaboration characteristics of the ICM industry and, thus, to know how to enhance its own international technological collaboration. This paper depicts the international technological collaboration characteristics of the ICM industry based on patent analysis. Four aspects, which include collaboration patterns, collaboration networks, collaboration institutions, and collaboration impacts, are analyzed by utilizing patent association analysis and social network analysis. The findings include the following: first, in regard to international technological collaboration, the USA has the highest level, while Germany has great potential for future development; second, Asia and Europe have already formed clusters, respectively, in the cooperative network; last, but not least, research institutions, colleges, and universities should also actively participate in international collaboration. In general, this study provides an objective reference for policy making, competitiveness, and sustainability in the ICM industry. The framework presented in this paper could be applied to examine other industrial international technological collaborations.

Keywords: international technological collaboration; IC manufacturing; patent association analysis; social network analysis; collaboration network (search for similar items in EconPapers)
JEL-codes: O13 Q Q0 Q2 Q3 Q5 Q56 (search for similar items in EconPapers)
Date: 2018
References: View references in EconPapers View complete reference list from CitEc
Citations: View citations in EconPapers (5)

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