The effectiveness study of Double Sampling s charts application on destructive testing process

Pei-Hsi Lee, Chau-Chen Torng, Jhih-Cyuan Wu and Chun-Chieh Tseng

International Journal of Product Development, 2010, vol. 12, issue 3/4, 324-335

Abstract: In semiconductor processes, many data of process were obtained by the destructive testing methods, which will incur high inspection cost. Double Sampling (DS) s charts can quickly detect the shifts of process standard deviation and effectively reduce sample size. In this study, DS s charts were designed based on a statistical viewpoint, and their performance was evaluated in comparison with Shewhart s charts. A real case of wire bonding process of IC packaging was used to demonstrate the effectiveness of proposed DS s charts in reducing the sample size of destructive testing.

Keywords: double sampling s charts; statistical process control; SPC; destructive testing; IC packaging; wire bonding; semiconductor manufacturing; control charts. (search for similar items in EconPapers)
Date: 2010
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