Ultraviolet light blocking optically clear adhesives for foldable displays via highly efficient visible-light curing

Yonghwan Kwon, Seokju Lee, Junkyu Kim, Jinwon Jun, Woojin Jeon, Youngjoo Park, Hyun-Joong Kim, Johannes Gierschner, Jaesang Lee (), Youngdo Kim () and Min Sang Kwon ()
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Yonghwan Kwon: Seoul National University
Seokju Lee: Seoul National University
Junkyu Kim: Seoul National University
Jinwon Jun: Seoul National University
Woojin Jeon: Seoul National University
Youngjoo Park: Seoul National University
Hyun-Joong Kim: Seoul National University
Johannes Gierschner: IMDEA Nanoscience, Calle Faraday 9
Jaesang Lee: Seoul National University
Youngdo Kim: Ltd.
Min Sang Kwon: Seoul National University

Nature Communications, 2024, vol. 15, issue 1, 1-11

Abstract: Abstract In developing an organic light-emitting diode (OLED) panel for a foldable smartphone (specifically, a color filter on encapsulation) aimed at reducing power consumption, the use of a new optically clear adhesive (OCA) that blocks UV light was crucial. However, the incorporation of a UV-blocking agent within the OCA presented a challenge, as it restricted the traditional UV-curing methods commonly used in the manufacturing process. Although a visible-light curing technique for producing UV-blocking OCA was proposed, its slow curing speed posed a barrier to commercialization. Our study introduces a highly efficient photo-initiating system (PIS) for the rapid production of UV-blocking OCAs utilizing visible light. We have carefully selected the photocatalyst (PC) to minimize electron and energy transfer to UV-blocking agents and have chosen co-initiators that allow for faster electron transfer and more rapid PC regeneration compared to previously established amine-based co-initiators. This advancement enabled a tenfold increase in the production speed of UV-blocking OCAs, while maintaining their essential protective, transparent, and flexible properties. When applied to OLED devices, this OCA demonstrated UV protection, suggesting its potential for broader application in the safeguarding of various smart devices.

Date: 2024
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DOI: 10.1038/s41467-024-47104-y

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