Monolithic back-end-of-line integration of phase change materials into foundry-manufactured silicon photonics

Maoliang Wei, Kai Xu, Bo Tang, Junying Li (), Yiting Yun, Peng Zhang, Yingchun Wu, Kangjian Bao, Kunhao Lei, Zequn Chen, Hui Ma, Chunlei Sun, Ruonan Liu, Ming Li (), Lan Li () and Hongtao Lin ()
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Maoliang Wei: Zhejiang University
Kai Xu: Zhejiang University
Bo Tang: Institute of Microelectronics of the Chinese Academy of Sciences
Junying Li: Zhejiang University
Yiting Yun: Zhejiang University
Peng Zhang: Institute of Microelectronics of the Chinese Academy of Sciences
Yingchun Wu: Westlake University
Kangjian Bao: Westlake University
Kunhao Lei: Zhejiang University
Zequn Chen: Westlake University
Hui Ma: Zhejiang University
Chunlei Sun: Westlake University
Ruonan Liu: Institute of Microelectronics of the Chinese Academy of Sciences
Ming Li: Chinese Academy of Sciences
Lan Li: Westlake University
Hongtao Lin: Zhejiang University

Nature Communications, 2024, vol. 15, issue 1, 1-9

Abstract: Abstract Monolithic integration of novel materials without modifying the existing photonic component library is crucial to advancing heterogeneous silicon photonic integrated circuits. Here we show the introduction of a silicon nitride etch stop layer at select areas, coupled with low-loss oxide trench, enabling incorporation of functional materials without compromising foundry-verified device reliability. As an illustration, two distinct chalcogenide phase change materials (PCMs) with remarkable nonvolatile modulation capabilities, namely Sb2Se3 and Ge2Sb2Se4Te1, were monolithic back-end-of-line integrated, offering compact phase and intensity tuning units with zero-static power consumption. By employing these building blocks, the phase error of a push-pull Mach–Zehnder interferometer optical switch could be reduced with a 48% peak power consumption reduction. Mirco-ring filters with >5-bit wavelength selective intensity modulation and waveguide-based >7-bit intensity-modulation broadband attenuators could also be achieved. This foundry-compatible platform could open up the possibility of integrating other excellent optoelectronic materials into future silicon photonic process design kits.

Date: 2024
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DOI: 10.1038/s41467-024-47206-7

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