Crosslinking-induced patterning of MOFs by direct photo- and electron-beam lithography
Xiaoli Tian,
Fu Li,
Zhenyuan Tang,
Song Wang,
Kangkang Weng,
Dan Liu,
Shaoyong Lu,
Wangyu Liu,
Zhong Fu,
Wenjun Li,
Hengwei Qiu,
Min Tu,
Hao Zhang () and
Jinghong Li
Additional contact information
Xiaoli Tian: Tsinghua University
Fu Li: Tsinghua University
Zhenyuan Tang: Chinese Academy of Sciences
Song Wang: Tsinghua University
Kangkang Weng: Tsinghua University
Dan Liu: Tsinghua University
Shaoyong Lu: Tsinghua University
Wangyu Liu: Tsinghua University
Zhong Fu: Tsinghua University
Wenjun Li: Tsinghua University
Hengwei Qiu: Tsinghua University
Min Tu: Chinese Academy of Sciences
Hao Zhang: Tsinghua University
Jinghong Li: Tsinghua University
Nature Communications, 2024, vol. 15, issue 1, 1-15
Abstract:
Abstract Metal-organic frameworks (MOFs) with diverse chemistry, structures, and properties have emerged as appealing materials for miniaturized solid-state devices. The incorporation of MOF films in these devices, such as the integrated microelectronics and nanophotonics, requires robust patterning methods. However, existing MOF patterning methods suffer from some combinations of limited material adaptability, compromised patterning resolution and scalability, and degraded properties. Here we report a universal, crosslinking-induced patterning approach for various MOFs, termed as CLIP-MOF. Via resist-free, direct photo- and electron-beam (e-beam) lithography, the ligand crosslinking chemistry leads to drastically reduced solubility of colloidal MOFs, permitting selective removal of unexposed MOF films with developer solvents. This enables scalable, micro-/nanoscale (≈70 nm resolution), and multimaterial patterning of MOFs on large-area, rigid or flexible substrates. Patterned MOF films preserve their crystallinity, porosity, and other properties tailored for targeted applications, such as diffractive gas sensors and electrochromic pixels. The combined features of CLIP-MOF create more possibilities in the system-level integration of MOFs in various electronic, photonic, and biomedical devices.
Date: 2024
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DOI: 10.1038/s41467-024-47293-6
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