Multilevel design and construction in nanomembrane rolling for three-dimensional angle-sensitive photodetection

Ziyu Zhang, Binmin Wu, Yang Wang, Tianjun Cai, Mingze Ma, Chunyu You, Chang Liu, Guobang Jiang, Yuhang Hu, Xing Li, Xiang-Zhong Chen, Enming Song, Jizhai Cui, Gaoshan Huang, Suwit Kiravittaya and Yongfeng Mei ()
Additional contact information
Ziyu Zhang: Fudan University
Binmin Wu: Fudan University
Yang Wang: Fudan University
Tianjun Cai: Fudan University
Mingze Ma: Fudan University
Chunyu You: Fudan University
Chang Liu: Fudan University
Guobang Jiang: Fudan University
Yuhang Hu: Fudan University
Xing Li: Fudan University
Xiang-Zhong Chen: Fudan University
Enming Song: Fudan University
Jizhai Cui: Fudan University
Gaoshan Huang: Fudan University
Suwit Kiravittaya: Chulalongkorn University
Yongfeng Mei: Fudan University

Nature Communications, 2024, vol. 15, issue 1, 1-13

Abstract: Abstract Releasing pre-strained two-dimensional nanomembranes to assemble on-chip three-dimensional devices is crucial for upcoming advanced electronic and optoelectronic applications. However, the release process is affected by many unclear factors, hindering the transition from laboratory to industrial applications. Here, we propose a quasistatic multilevel finite element modeling to assemble three-dimensional structures from two-dimensional nanomembranes and offer verification results by various bilayer nanomembranes. Take Si/Cr nanomembrane as an example, we confirm that the three-dimensional structural formation is governed by both the minimum energy state and the geometric constraints imposed by the edges of the sacrificial layer. Large-scale, high-yield fabrication of three-dimensional structures is achieved, and two distinct three-dimensional structures are assembled from the same precursor. Six types of three-dimensional Si/Cr photodetectors are then prepared to resolve the incident angle of light with a deep neural network model, opening up possibilities for the design and manufacturing methods of More-than-Moore-era devices.

Date: 2024
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DOI: 10.1038/s41467-024-47405-2

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