International R&D Funding and Patent Collateral in an R&D-Growth Model

Wei-chi Huang, Ping-Ho Chen () and Ching-chong Lai

MPRA Paper from University Library of Munich, Germany

Abstract: This paper develops an R&D-based growth model featuring international R&D funding and patent collateral. It then uses the model to examine how the international borrowing interest rate and the fraction of patent collateral will affect innovations and economic growth.

Keywords: International R&D funding; patent collateral; R&D-based growth model (search for similar items in EconPapers)
JEL-codes: E44 O31 O40 (search for similar items in EconPapers)
Date: 2016-11-03
New Economics Papers: this item is included in nep-cse, nep-gro, nep-ino, nep-ipr, nep-knm and nep-mac
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Persistent link: https://EconPapers.repec.org/RePEc:pra:mprapa:74881

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