Psychological Distress, Burnout, and Business Student Turnover: The Role of Resilience as a Coping Mechanism
David J. Emerson (),
Joseph F. Hair () and
Kenneth J. Smith ()
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David J. Emerson: Salisbury University
Joseph F. Hair: University of South Alabama
Kenneth J. Smith: Salisbury University
Research in Higher Education, 2023, vol. 64, issue 2, No 4, 228-259
Abstract:
Abstract This study’s purpose is to examine whether resilience, conceptualized by Connor and Davidson (2003) as one’s capacity to persevere and rebound under adversity, was a potential mitigating and/or moderating factor in the dynamic between both psychological distress and academic burnout, and student attrition. We concurrently distributed a survey containing a series of psychometric instruments to a convenience sample of 1,119 students pursuing various business majors at four geographically diverse U.S. universities. Via structural equations modeling analysis, we measured the associations between psychological distress, academic burnout, and departure intentions, and investigated whether student resilience levels are associated with lower distress, burnout, and departure intentions levels. The results indicated significant positive associations between psychological distress and each of the elements of academic burnout, and significant positive associations between the academic burnout elements and departure intentions. However, while resilience did not moderate those associations, it did attenuate them through its direct negative associations with both psychological distress and the cynicism and academic inefficacy elements of academic burnout. Based on these findings, we discuss implications for business educators seeking to enhance individual resilience levels as a coping strategy to combat voluntary student turnover, and better prepare students for the demands of the workplace.
Keywords: Resilience; Psychological distress; Academic Burnout; Departure Intentions (search for similar items in EconPapers)
Date: 2023
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Persistent link: https://EconPapers.repec.org/RePEc:spr:reihed:v:64:y:2023:i:2:d:10.1007_s11162-022-09704-9
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DOI: 10.1007/s11162-022-09704-9
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