Optimal Parallel Machine Allocation Problem in IC Packaging Using IC-PSO: An Empirical Study

Robert Cuckler (), Kuo-Hao Chang and Liam Y. Hsieh ()
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Robert Cuckler: Department of Industrial Engineering and Engineering Management, National Tsing Hua University, Hsinchu 30013, Taiwan
Kuo-Hao Chang: Department of Industrial Engineering and Engineering Management, National Tsing Hua University, Hsinchu 30013, Taiwan
Liam Y. Hsieh: Department of Systems Engineering and Operations Research, George Mason University, Fairfax VA 22030, USA

Asia-Pacific Journal of Operational Research (APJOR), 2017, vol. 34, issue 06, 1-20

Abstract: We model and apply a stochastic-simulation-based methodology to optimize the machine allocation of a flexible flow shop (FFS) dedicated to integrated circuit (IC) packaging. This contrasts with most previous research on non-deterministic FFS problems wherein stochastic simulation is mostly used to estimate throughput, cycle time, delay cost, or some other measure(s) in order to compare the performances of already-existing heuristic-based algorithms. The methodology applied in this research, called progressive simulation metamodeling for IC Packaging (IC-PSO), while rooted in the traditional metamodeling technique known as Response Surface Methodology (RSM), contrasts with RSM in that it is equipped with well-designed mechanisms to ensure an ever-increasing solution quality in an attempt to achieve the desirable optimality. The computational efficiency that IC-PSO affords IC packaging companies is demonstrated via a numerical study. Meanwhile, an empirical study based on real data was conducted to validate the viability of the proposed methodology in real settings.

Keywords: Integrated circuit packaging; flexible flow shop; simulation metamodeling; semiconductor manufacturing (search for similar items in EconPapers)
Date: 2017
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DOI: 10.1142/S0217595917500348

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