ELECTROCHEMICAL MIGRATION BEHAVIOR OF Sn-3.0Ag-0.5Cu SOLDER ALLOY UNDER THIN ELECTROLYTE LAYERS

Bokai Liao, Wenfeng Jia, Ruiyan Sun, Zhenyu Chen and Xingpeng Guo
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Bokai Liao: Hubei Key Laboratory of Materials Chemistry and Service Failure, School of Chemistry and Chemical Engineering, Huazhong University of Science and Technology, Wuhan 430074, P. R. China
Wenfeng Jia: #x2020;Sinopec Research Institute of Petroleum Engineering, Beijing 100101, P. R. China
Ruiyan Sun: #x2021;Survey and Design Institute, Jilin Oilfield, Songyuan 138001, P. R. China
Zhenyu Chen: Hubei Key Laboratory of Materials Chemistry and Service Failure, School of Chemistry and Chemical Engineering, Huazhong University of Science and Technology, Wuhan 430074, P. R. China
Xingpeng Guo: Hubei Key Laboratory of Materials Chemistry and Service Failure, School of Chemistry and Chemical Engineering, Huazhong University of Science and Technology, Wuhan 430074, P. R. China

Surface Review and Letters (SRL), 2019, vol. 26, issue 06, 1-7

Abstract: The electrochemical migration (ECM) behavior of Sn-3.0Ag-0.5Cu solder alloy under thin electrolyte layers was investigated using a technique based on the coupling of in situ electrochemical measurements and optical observation. Results showed that the mean time to failure first increased and then decreased as thickness of the electrolyte layer increased, the maximum value was present at 200μm. The higher the bias voltage applied, the faster was the rate of dendrite growth. And, Sn leaded the ECM of SAC305 solder alloy. Mechanisms relevant have been proposed to explain the ECM behavior of Sn-3.0Ag-0.5Cu solder alloy.

Keywords: Solder alloy; corrosion; electrochemical migration; dendrite (search for similar items in EconPapers)
Date: 2019
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Citations: View citations in EconPapers (1)

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DOI: 10.1142/S0218625X18502086

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