Enabling Accelerated Installation of Aftermarket On-Board Equipment for Connected Vehicles

Ching-Yao Chan

Institute of Transportation Studies, Research Reports, Working Papers, Proceedings from Institute of Transportation Studies, UC Berkeley

Abstract: This report summarizes previous findings and describes recent developments with regards to rapid introduction of aftermarket on-board equipment (OBE) devices for connected vehicles to the vehicle fleet. An integration assessment for aftermarket OBE devices will be discussed. An analysis of outside market forces that may affect driver adoption of connected vehicle technologies is shared. Finally, recommendations are provided for strategic approaches to foster the rapid introduction of aftermarket OBE devices and garner consumer interests to purchase these devices.

Keywords: Engineering; Connected vehicles; On-board equipment; OBE; Aftermarket devices (search for similar items in EconPapers)
Date: 2012-04-01
References: View complete reference list from CitEc
Citations:

Downloads: (external link)
https://www.escholarship.org/uc/item/7k50q6qh.pdf;origin=repeccitec (application/pdf)

Related works:
This item may be available elsewhere in EconPapers: Search for items with the same title.

Export reference: BibTeX RIS (EndNote, ProCite, RefMan) HTML/Text

Persistent link: https://EconPapers.repec.org/RePEc:cdl:itsrrp:qt7k50q6qh

Access Statistics for this paper

More papers in Institute of Transportation Studies, Research Reports, Working Papers, Proceedings from Institute of Transportation Studies, UC Berkeley Contact information at EDIRC.
Bibliographic data for series maintained by Lisa Schiff ().