EconPapers    
Economics at your fingertips  
 

INTERNATIONAL COMPETITION AND U.S. R&D SUBSIDIES: A QUANTITATIVE WELFARE ANALYSIS

Giammario Impullitti

International Economic Review, 2010, vol. 51, issue 4, 1127-1158

Abstract: In the early 1970s U.S. firms were the uncontested world leaders in R&D investment in most manufacturing sectors. Later, led by Japan and Europe, foreign firms began to challenge American R&D leadership in many sectors of the economy. This period of increasing technological competition is contemporaneous with a substantial increase in U.S. R&D subsidies. What is the effect of the observed increase in international competition on U.S. welfare? How does foreign competition affect the optimal R&D subsidy in the United States, and, consequently, how far is this from the subsidy observed in the data? This article addresses these questions in a two-country quality ladder growth model.

Date: 2010
References: Add references at CitEc
Citations: View citations in EconPapers (56)

Downloads: (external link)
http://hdl.handle.net/10.1111/j.1468-2354.2010.00613.x

Related works:
Working Paper: International Competition and U.S. R&D Subsidies: A Quantitative Welfare Analysis (2008) Downloads
Working Paper: International Competition and U.S. R&D Subsidies: A Quantitative Welfare Analysis (2008) Downloads
This item may be available elsewhere in EconPapers: Search for items with the same title.

Export reference: BibTeX RIS (EndNote, ProCite, RefMan) HTML/Text

Persistent link: https://EconPapers.repec.org/RePEc:ier:iecrev:v:51:y:2010:i:4:p:1127-1158

Ordering information: This journal article can be ordered from
http://www.blackwell ... bs.asp?ref=0020-6598

Access Statistics for this article

International Economic Review is currently edited by Harold L. Cole

More articles in International Economic Review from Department of Economics, University of Pennsylvania and Osaka University Institute of Social and Economic Research Association 160 McNeil Building, 3718 Locust Walk, Philadelphia, PA 19104-6297. Contact information at EDIRC.
Bibliographic data for series maintained by Wiley-Blackwell Digital Licensing () and ().

 
Page updated 2025-03-19
Handle: RePEc:ier:iecrev:v:51:y:2010:i:4:p:1127-1158