A Statistical Approach to Three-Dimensional Shape Inspection of Micro-Solder Balls

Jee Hong Kim
Additional contact information
Jee Hong Kim: Pukyong National University, Busan, South Korea

International Journal of Manufacturing, Materials, and Mechanical Engineering (IJMMME), 2020, vol. 10, issue 3, 24-33

Abstract: This article presents an optical technique for the three-dimensional (3D) shape inspection of micro-solder balls used in ball grid array (BGA) packaging, before attaching them to a board or film. This technique uses an optical source comprising spatially arranged light-emitting diodes (LEDs), and the results are derived based on the specular reflection characteristics of the BGA balls. A vision system is designed to acquire the reflected image from the micro-solder balls. For shape inspection, the locations of the LED point-light-source reflections are determined via image processing, and defects in 3D BGA shapes are detected using statistical information of the relative positions of multiple BGA balls captured in the images. Experiments were conducted to validate our proposed method, and the results revealed that it allows for simultaneous inspection of multiple BGA balls placed arbitrarily in a glass dish, without the need for precise ball-position control.

Date: 2020
References: Add references at CitEc
Citations:

Downloads: (external link)
http://services.igi-global.com/resolvedoi/resolve. ... 18/IJMMME.2020070102 (application/pdf)

Related works:
This item may be available elsewhere in EconPapers: Search for items with the same title.

Export reference: BibTeX RIS (EndNote, ProCite, RefMan) HTML/Text

Persistent link: https://EconPapers.repec.org/RePEc:igg:jmmme0:v:10:y:2020:i:3:p:24-33

Access Statistics for this article

International Journal of Manufacturing, Materials, and Mechanical Engineering (IJMMME) is currently edited by J. Paulo Davim

More articles in International Journal of Manufacturing, Materials, and Mechanical Engineering (IJMMME) from IGI Global
Bibliographic data for series maintained by Journal Editor ().