High-temperature-resistant silicon-polymer hybrid modulator operating at up to 200 Gbit s−1 for energy-efficient datacentres and harsh-environment applications

Guo-Wei Lu (), Jianxun Hong, Feng Qiu, Andrew M. Spring, Tsubasa Kashino, Juro Oshima, Masa-aki Ozawa, Hideyuki Nawata and Shiyoshi Yokoyama ()
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Guo-Wei Lu: Kyushu University
Jianxun Hong: Kyushu University
Feng Qiu: Kyushu University
Andrew M. Spring: Kyushu University
Tsubasa Kashino: Nissan Chemical Corporation
Juro Oshima: Nissan Chemical Corporation
Masa-aki Ozawa: Nissan Chemical Corporation
Hideyuki Nawata: Nissan Chemical Corporation
Shiyoshi Yokoyama: Kyushu University

Nature Communications, 2020, vol. 11, issue 1, 1-9

Abstract: Abstract To reduce the ever-increasing energy consumption in datacenters, one of the effective approaches is to increase the ambient temperature, thus lowering the energy consumed in the cooling systems. However, this entails more stringent requirements for the reliability and durability of the optoelectronic components. Herein, we fabricate and demonstrate silicon-polymer hybrid modulators which support ultra-fast single-lane data rates up to 200 gigabits per second, and meanwhile feature excellent reliability with an exceptional signal fidelity retained at extremely-high ambient temperatures up to 110 °C and even after long-term exposure to high temperatures. This is achieved by taking advantage of the high electro-optic (EO) activities (in-device n3r33 = 1021 pm V−1), low dielectric constant, low propagation loss (α, 0.22 dB mm−1), and ultra-high glass transition temperature (Tg, 172 °C) of the developed side-chain EO polymers. The presented modulator simultaneously fulfils the requirements of bandwidth, EO efficiency, and thermal stability for EO modulators. It could provide ultra-fast and reliable interconnects for energy-hungry and harsh-environment applications such as datacentres, 5G/B5G, autonomous driving, and aviation systems, effectively addressing the energy consumption issue for the next-generation optical communication.

Date: 2020
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DOI: 10.1038/s41467-020-18005-7

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