A universal method for depositing patterned materials in situ

Yifan Chen, Siu Fai Hung, Wing Ki Lo, Yang Chen, Yang Shen, Kim Kafenda, Jia Su, Kangwei Xia () and Sen Yang ()
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Yifan Chen: The Chinese University of Hong Kong, Shatin
Siu Fai Hung: The Chinese University of Hong Kong, Shatin
Wing Ki Lo: The Chinese University of Hong Kong, Shatin
Yang Chen: The Chinese University of Hong Kong, Shatin
Yang Shen: The Chinese University of Hong Kong, Shatin
Kim Kafenda: The Chinese University of Hong Kong, Shatin
Jia Su: South University of Science and Technology of China
Kangwei Xia: The Chinese University of Hong Kong, Shatin
Sen Yang: The Chinese University of Hong Kong, Shatin

Nature Communications, 2020, vol. 11, issue 1, 1-8

Abstract: Abstract Current techniques of patterned material deposition require separate steps for patterning and material deposition. The complexity and harsh working conditions post serious limitations for fabrication. Here, we introduce a single-step and easy-to-adapt method that can deposit materials in-situ. Its methodology is based on the semiconductor nanoparticle assisted photon-induced chemical reduction and optical trapping. This universal mechanism can be used for depositing a large selection of materials including metals, insulators and magnets, with quality on par with current technologies. Patterning with several materials together with optical-diffraction-limited resolution and accuracy can be achieved from macroscopic to microscopic scale. Furthermore, the setup is naturally compatible with optical microscopy based measurements, thus sample characterisation and material deposition can be realised in-situ. Various devices fabricated with this method in 2D or 3D show it is ready for deployment in practical applications. This method will provide a distinct tool in material technology.

Date: 2020
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DOI: 10.1038/s41467-020-19210-0

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