Low thermal contact resistance boron nitride nanosheets composites enabled by interfacial arc-like phonon bridge

Ke Zhan, Yucong Chen, Zhiyuan Xiong (), Yulun Zhang, Siyuan Ding, Fangzheng Zhen, Zhenshi Liu, Qiang Wei, Minsu Liu, Bo Sun, Hui-Ming Cheng () and Ling Qiu ()
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Ke Zhan: Tsinghua University
Yucong Chen: Tsinghua University
Zhiyuan Xiong: South China University of Technology
Yulun Zhang: Tsinghua University
Siyuan Ding: Tsinghua University
Fangzheng Zhen: Monash University
Zhenshi Liu: Ltd.
Qiang Wei: Ltd.
Minsu Liu: Tsinghua University
Bo Sun: Tsinghua University
Hui-Ming Cheng: Chinese Academy of Sciences
Ling Qiu: Tsinghua University

Nature Communications, 2024, vol. 15, issue 1, 1-12

Abstract: Abstract Two-dimensional materials with ultrahigh in-plane thermal conductivity are ideal for heat spreader applications but cause significant thermal contact resistance in complex interfaces, limiting their use as thermal interface materials. In this study, we present an interfacial phonon bridge strategy to reduce the thermal contact resistance of boron nitride nanosheets-based composites. By using a low-molecular-weight polymer, we are able to manipulate the alignment of boron nitride nanosheets through sequential stacking and cutting, ultimately achieving flexible thin films with a layer of arc-like structure superimposed on perpendicularly aligned ones. Our results suggest that arc-like structure can act as a phonon bridge to lower the contact resistance by 70% through reducing phonon back-reflection and enhancing phonon coupling efficiency at the boundary. The resulting composites exhibit ultralow thermal contact resistance of 0.059 in2 KW−1, demonstrating effective cooling of fast-charging batteries at a thickness 2-5 times thinner than commercial products.

Date: 2024
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DOI: 10.1038/s41467-024-47147-1

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