Synergistically optimized electron and phonon transport in high-performance copper sulfides thermoelectric materials via one-pot modulation

Yi-Xin Zhang, Qin-Yuan Huang, Xi Yan, Chong-Yu Wang, Tian-Yu Yang, Zi-Yuan Wang, Yong-Cai Shi, Quan Shan, Jing Feng and Zhen-Hua Ge ()
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Yi-Xin Zhang: Kunming University of Science and Technology
Qin-Yuan Huang: Kunming University of Science and Technology
Xi Yan: Kunming University of Science and Technology
Chong-Yu Wang: Kunming University of Science and Technology
Tian-Yu Yang: Kunming University of Science and Technology
Zi-Yuan Wang: Kunming University of Science and Technology
Yong-Cai Shi: Kunming University of Science and Technology
Quan Shan: Kunming University of Science and Technology
Jing Feng: Kunming University of Science and Technology
Zhen-Hua Ge: Kunming University of Science and Technology

Nature Communications, 2024, vol. 15, issue 1, 1-10

Abstract: Abstract Optimizing thermoelectric conversion efficiency requires the compromise of electrical and thermal properties of materials, which are hard to simultaneously improve due to the strong coupling of carrier and phonon transport. Herein, a one-pot approach realizing simultaneous second phase and Cu vacancies modulation is proposed, which is effective in synergistically optimizing thermoelectric performance in copper sulfides. Multiple lattice defects, including nanoprecipitates, dislocations, and nanopores are produced by adding a refined ratio of Sn and Se. Phonon transport is significantly suppressed by multiple mechanisms. An ultralow lattice thermal conductivity is therefore obtained. Furthermore, extra Se is added in the copper sulfide for optimizing electrical transport properties by inducing generating Cu vacancies. Ultimately, an excellent figure of merit of ~1.6 at 873 K is realized in the Cu1.992SSe0.016(Cu2SnSe4)0.004 bulk sample. The simple strategy of inducing compositional and structural modulation for improving thermoelectric parameters promotes low-cost high-performance copper sulfides as alternatives in thermoelectric applications.

Date: 2024
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DOI: 10.1038/s41467-024-47148-0

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