Designed wrinkles for optical encryption and flexible integrated circuit carrier board

Shilong Zhong, Zhaoxiang Zhu, Qizheng Huo, Yubo Long, Li Gong, Zetong Ma, Dingshan Yu, Yi Zhang, Weien Liang, Wei Liu, Cheng Wang, Zhongke Yuan, Yuzhao Yang, Shaolin Lu, Yujie Chen (), Zhikun Zheng () and Xudong Chen ()
Additional contact information
Shilong Zhong: Guangdong University of Technology
Zhaoxiang Zhu: Sun Yat-sen University
Qizheng Huo: Unit 66018 of the People’s Liberation Army
Yubo Long: Sun Yat-sen University
Li Gong: Sun Yat-sen University
Zetong Ma: Guangdong University of Technology
Dingshan Yu: Sun Yat-sen University
Yi Zhang: Sun Yat-sen University
Weien Liang: Guangdong University of Technology
Wei Liu: Sun Yat-sen University
Cheng Wang: Guangdong University of Technology
Zhongke Yuan: Guangdong University of Technology
Yuzhao Yang: Guangdong University of Technology
Shaolin Lu: Guangdong University of Technology
Yujie Chen: Sun Yat-sen University
Zhikun Zheng: Guangdong University of Technology
Xudong Chen: Guangdong University of Technology

Nature Communications, 2024, vol. 15, issue 1, 1-8

Abstract: Abstract Patterns on polymers usually have different mechanical properties as those of the substrates, causing deformation or distortion and even detachment of the patterns from the polymer substrates. Herein, we present a wrinkling strategy, which utilizes photolithography to define the area of stress distribution by light-induced physical crosslinking of polymers and controls diffusion of residual solvent to redistribute the stress and then offers the same material for patterns as substrate by thermal polymerization, providing uniform wrinkles without worrying about force relaxation. The strategy allows the recording and hiding of up to eight switchable images in one place that can be read by the naked eye without crosstalk, applying the wrinkled polymer for optical anti-counterfeiting. The wrinkled polyimide film was also utilized to act as a substrate for the creation of fine copper circuit by a full-additive process. It generates flexible integrated circuit (IC) carrier board with copper wire density of 400% higher than that of the state-of-the-art in industry while fulfilling the standards for industrialization.

Date: 2024
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DOI: 10.1038/s41467-024-50069-7

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