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Malleable, printable, bondable, and highly conductive MXene/liquid metal plasticine with improved wettability

Haojie Jiang, Bin Yuan, Hongtao Guo, Fei Pan, Fanmao Meng, Yongpeng Wu, Xiao Wang, Lingyang Ruan, Shuhuai Zheng, Yang Yang, Zheng Xiu, Lixin Li, Changsheng Wu, Yongqing Gong, Menghao Yang and Wei Lu ()
Additional contact information
Haojie Jiang: Tongji University
Bin Yuan: Tongji University
Hongtao Guo: Tongji University
Fei Pan: Tongji University
Fanmao Meng: Tongji University
Yongpeng Wu: University of Shanghai for Science and Technology
Xiao Wang: Tongji University
Lingyang Ruan: Tongji University
Shuhuai Zheng: Tongji University
Yang Yang: Tongji University
Zheng Xiu: Tongji University
Lixin Li: Tongji University
Changsheng Wu: National University of Singapore
Yongqing Gong: Tongji University
Menghao Yang: Tongji University
Wei Lu: Tongji University

Nature Communications, 2024, vol. 15, issue 1, 1-12

Abstract: Abstract Integration of functional fillers into liquid metals (LM) induces rheology modification, enabling the free-form shaping of LM at the micrometer scale. However, integrating non-chemically modified low-dimensional materials with LM to form stable and uniform dispersions remain a great challenge. Herein, we propose a solvent-assisted dispersion (SAD) method that utilizes the fragmentation and reintegration of LM in volatile solvents to engulf and disperse fillers. This method successfully integrates MXene uniformly into LM, achieving better internal connectivity than the conventional dry powder mixing (DPM) method. Consequently, the MXene/LM (MLM) coating exhibits high electromagnetic interference (EMI) shielding performance (105 dB at 20 μm, which is 1.6 times that of coatings prepared by DPM). Moreover, the rheological characteristic of MLM render it malleable and facilitates direct printing and adaptation to diverse structures. This study offers a convenient method for assembling LM with low-dimensional materials, paving the way for the development of multifunctional soft devices.

Date: 2024
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DOI: 10.1038/s41467-024-50541-4

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