Realization of a three-dimensional photonic higher-order topological insulator

Ziyao Wang, Yan Meng, Bei Yan, Dong Zhao, Linyun Yang, Jingming Chen, Minqi Cheng, Tao Xiao, Perry Ping Shum, Gui-Geng Liu, Yihao Yang, Hongsheng Chen, Xiang Xi (), Zhen-Xiao Zhu (), Biye Xie () and Zhen Gao ()
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Ziyao Wang: Southern University of Science and Technology
Yan Meng: Dongguan University of Technology
Bei Yan: Wuhan University of Science and Technology
Dong Zhao: Southern University of Science and Technology
Linyun Yang: Chongqing University
Jingming Chen: Southern University of Science and Technology
Minqi Cheng: Southern University of Science and Technology
Tao Xiao: Southern University of Science and Technology
Perry Ping Shum: Southern University of Science and Technology
Gui-Geng Liu: Westlake University
Yihao Yang: Zhejiang University
Hongsheng Chen: Zhejiang University
Xiang Xi: Dongguan University of Technology
Zhen-Xiao Zhu: Southern University of Science and Technology
Biye Xie: The Chinese University of Hong Kong
Zhen Gao: Southern University of Science and Technology

Nature Communications, 2025, vol. 16, issue 1, 1-8

Abstract: Abstract The discovery of photonic higher-order topological insulators (HOTIs) has expanded our understanding of band topology, offering robust lower-dimensional boundary states for photonic devices. However, realizing three-dimensional (3D) photonic HOTIs remains challenging due to the vectorial and leaky nature of electromagnetic waves. Here, we present the experimental realization of a 3D Wannier-type photonic HOTI using a tight-binding-like metal-cage photonic crystal, whose band structures align with a 3D tight-binding model via confined Mie resonances. Microwave near-field measurements reveal coexisting topological surface, hinge, and corner states in a single 3D photonic HOTI, consistent with theoretical predictions. Remarkably, these states are robust and self-guided even within the light cone continuum, functioning without ancillary cladding. This work paves the way for multi-dimensional manipulation of electromagnetic waves on 3D cladding-free photonic bandgap materials, enabling practical applications in 3D topological integrated photonic devices.

Date: 2025
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DOI: 10.1038/s41467-025-58051-7

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