Oxide-dispersion-enabled laser additive manufacturing of high-resolution copper

Shuo Qu, Liqiang Wang, Shengbiao Zhang, Chenfeng Yang, Hou Yi Chia, Gengbo Wu, Zongxin Hu, Junhao Ding, Wentao Yan, Yang Zhang, Chi Hou Chan, Wen Chen (), Yang Lu () and Xu Song ()
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Shuo Qu: Chinese University of Hong Kong
Liqiang Wang: City University of Hong Kong
Shengbiao Zhang: University of Massachusetts
Chenfeng Yang: City University of Hong Kong
Hou Yi Chia: National University of Singapore
Gengbo Wu: City University of Hong Kong
Zongxin Hu: Chinese University of Hong Kong
Junhao Ding: Chinese University of Hong Kong
Wentao Yan: National University of Singapore
Yang Zhang: Shaanxi University of Technology
Chi Hou Chan: City University of Hong Kong
Wen Chen: University of Massachusetts
Yang Lu: The University of Hong Kong
Xu Song: Chinese University of Hong Kong

Nature Communications, 2025, vol. 16, issue 1, 1-13

Abstract: Abstract Laser additive manufacturing of pure copper (Cu) with complex geometries opens vast opportunities for the development of functional devices in microelectronics and telecommunication. However, laser additive manufacturing of high-resolution pure Cu remains a challenge. Here we report a facile oxide-dispersion-strengthening (ODS) strategy that enables additive manufacturing of Cu with sub-100 μm (~70 μm) resolution by laser powder-bed fusion. This ODS strategy starts with oxygen-assisted gas atomisation to introduce ultrafine Cu2O nanoparticles into the pure Cu powder feedstock. These nanoscale dispersoids not only improve the laser absorptivity and the viscosity of the melt but also promote dynamic wetting behaviour. The ODS Cu exhibits a remarkable yield strength of ~450 MPa and a large uniform elongation of ~12%, while preserving a high electrical conductivity. As an example, we printed an ODS Cu micro-architected terahertz antenna, which demonstrates a 2.5-fold improvement in signal intensity compared with traditional 3D-printed pure Cu antennas.

Date: 2025
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DOI: 10.1038/s41467-025-58373-6

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