Nano-engineered thin-film thermoelectric materials enable practical solid-state refrigeration

Jake Ballard, Matthew Hubbard, Sung-Jin Jung, Vanessa Rojas, Richard Ung, Junwoo Suh, MinSoo Kim, Joonhyun Lee, Jonathan M. Pierce and Rama Venkatasubramanian ()
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Jake Ballard: Johns Hopkins University Applied Physics Laboratory (JHUAPL)
Matthew Hubbard: Johns Hopkins University Applied Physics Laboratory (JHUAPL)
Sung-Jin Jung: Samsung Electronics
Vanessa Rojas: Johns Hopkins University Applied Physics Laboratory (JHUAPL)
Richard Ung: Johns Hopkins University Applied Physics Laboratory (JHUAPL)
Junwoo Suh: Samsung Electronics
MinSoo Kim: Samsung Electronics
Joonhyun Lee: Samsung Electronics
Jonathan M. Pierce: Johns Hopkins University Applied Physics Laboratory (JHUAPL)
Rama Venkatasubramanian: Johns Hopkins University Applied Physics Laboratory (JHUAPL)

Nature Communications, 2025, vol. 16, issue 1, 1-9

Abstract: Abstract Refrigeration needs are increasing worldwide with a demand for alternates to bulky poorly scalable vapor compression systems. Here, we demonstrate the first proof of practical solid-state refrigeration, using nano-engineered controlled hierarchically engineered superlattice thin-film thermoelectric materials. With 100%-better thermoelectric materials figure of merit, ZT, than the conventional bulk materials near 300 K, we demonstrate (i) module-level ZT greater than 75% and (ii) a system-level refrigeration ZT 70% better than that of bulk devices. Thin-film thermoelectric modules offer 100–300% better coefficient-of-performance than bulk devices depending on operational scenarios; system-level coefficient-of-performance is ~15 for temperature differentials of 1.3 °C. The thin-film devices enable more heat pumping per P-N couple, relevant for distributed and portable refrigeration, and electronics cooling. Beyond the demonstration of nano-engineered materials for a system-level advantage, we utilize 1/1000th active materials with scalable microelectronic manufacturing. The improved efficiency and ultra-low thermoelectric materials usage herald a new beginning in solid-state refrigeration.

Date: 2025
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DOI: 10.1038/s41467-025-59698-y

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