Study on aluminum nitride/addition-cure liquid silicone rubber composite for high-voltage power encapsulation

Zhenzhen Ou, Feng Gao, Lingjian Zhu, Huaijun Zhao and Zihan Xun

PLOS ONE, 2021, vol. 16, issue 6, 1-16

Abstract: In view of the development direction of high power and miniaturization of high-voltage power supply, higher requirements are put forward for the breakdown strength, thermal conductivity of packaging materials for its high voltage output module. An electric-insulated heat-conducted material with aluminium nitride as heat conducting filler and addition-cure liquid silicone rubber (ALSR) as matrix for high voltage power encapsulation has been studied. Initially, the thermal conductivity and breakdown strength of composites were explored at different filler fractions. With increase of filler fraction, the thermal conductivity increased and the breakdown strength decreased. Then, with the packaging module volume as the optimization objective and the working temperature as the optimization condition, the temperature distribution of high voltage power supply was studied by using the finite element method, and 40wt% filling fraction was selected as the optimal ratio. Finally, the actual packaging experiment of the high voltage module is carried out. and the variation of the output voltage and temperature with the working time is obtained. According to the experimental results, the output voltage of the high voltage module is basically stable, and the maximum surface temperature is 40.4°C. The practicability of the electric-insulated heat-conducted material has been proved.

Date: 2021
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Persistent link: https://EconPapers.repec.org/RePEc:plo:pone00:0252619

DOI: 10.1371/journal.pone.0252619

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