Study on the Main Contents of the Fiscal Measures of the U.S. Chip Act and Their Actionability Under the WTO Perspective

Tehong Ye ()
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Tehong Ye: Guangdong University of Foreign Study, School of Law

A chapter in Proceedings of the 8th International Conference on Financial Innovation and Economic Development (ICFIED 2023), 2023, pp 261-267 from Springer

Abstract: Abstract Against the background of the prevalence of unilateral protectionism and the obstruction of WTO multilateral trade system reform, the United States provides huge financial subsidies and tax credits to its semiconductor industry and related enterprises through the Chip Act in an attempt to enhance the competitiveness of the U.S. semiconductor industry and dominate the international semiconductor market. Through a combination of literature review and case analysis, the main contents of the fiscal measures of the Chip Act are clarified, and its actionability is analyzed in conjunction with the SCM agreement, and it is found that it meets the general conditions of subsidies and has the characteristics of specificity, and at the same time causes damage to other countries’ industries, which constitutes an actionable subsidy. Other countries can take unilateral countermeasures accordingly, or resort to multilateral dispute settlement bodies such as WTO.

Keywords: unilateral protectionism; the fiscal measures of the U.S. Chip Act; WTO; actionable subsidy (search for similar items in EconPapers)
Date: 2023
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Persistent link: https://EconPapers.repec.org/RePEc:spr:advbcp:978-94-6463-142-5_29

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DOI: 10.2991/978-94-6463-142-5_29

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