Mapping Innovation Opportunities in Age-Friendly Artificial Intelligence: An Interdisciplinary Approach

Jing Wang () and Fei Yuan
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Jing Wang: Beijing University of Technology
Fei Yuan: Beijing University of Technology

A chapter in Proceedings of the 2024 6th Management Science Informatization and Economic Innovation Development Conference (MSIEID 2024), 2025, pp 669-683 from Springer

Abstract: Abstract In China, the rapid transition into an aging society has underscored the critical role of technology, particularly artificial intelligence (AI), in addressing the challenges of population aging. This study adopts an interdisciplinary approach to systematically identify innovation opportunities in age-friendly AI solutions. By integrating insights from literature and policy analyses with patent data, it examines aging-related demands and explores technological subfields and key innovation areas. Employing methods such as clustering analysis and comprehensive index evaluation, the research identifies core, emerging, and frontier technologies. A demand-technology-product innovation opportunity map is constructed through manual analysis, highlighting critical areas such as intelligent home care, entertainment systems, and security monitoring. Key innovation opportunities are identified in technologies including medical anesthesia and relaxation, aging-friendly alarm systems, information system applications, and image recognition. The study advocates for leveraging interdisciplinary expertise in fields like traffic engineering, health management, and medical informatics to drive AI innovation for the elderly. It also emphasizes the importance of big data platforms for meeting health-related needs and advancing product innovation in smart home and entertainment systems tailored to aging populations.

Keywords: Interdisciplinary; Innovation Opportunities; Age-friendly; Patent Analysis; Artificial Intelligent (search for similar items in EconPapers)
Date: 2025
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Persistent link: https://EconPapers.repec.org/RePEc:spr:advbcp:978-94-6463-676-5_65

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DOI: 10.2991/978-94-6463-676-5_65

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