TEMPERATURE DEPENDENCE OF ELECTROLESSNi–PDEPOSITION ON POLYESTER FABRIC

R. H. Guo, S. Q. Jiang (), C. W. M. Yuen and M. C. F. Ng
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R. H. Guo: Institute of Textiles and Clothing, The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong, China
S. Q. Jiang: Institute of Textiles and Clothing, The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong, China
C. W. M. Yuen: Institute of Textiles and Clothing, The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong, China
M. C. F. Ng: Institute of Textiles and Clothing, The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong, China

Surface Review and Letters (SRL), 2008, vol. 15, issue 05, 587-593

Abstract: The effects of plating temperature on the plating rate,Pcontent, surface morphology, and electrical resistance of the electrolessNi–Pdeposits were studied. The results showed that the deposition rate of theNi–Pdeposit andPcontent of theNi–Player increased with the rise of temperature of the plating bath. Scanning electron microscopy of theNi–Pdeposits showed a nodule structure. TheNi–Pplating layers had an amorphous structure and surface resistance of the layer decreased with the rise of temperature. In addition, the electromagnetic interference shielding effectiveness (EMI SE) of electrolessNi–Pplated polyester fabric was also investigated. The result indicated that EMI SE ofNi–Pplated polyester fabric was close to 45–50 dB when the surface resistance was 0.63 Ω/□.

Keywords: ElectrolessNi–Pplating; polyester fabric; microstructure; surface resistance; electromagnetic interference shielding (search for similar items in EconPapers)
Date: 2008
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DOI: 10.1142/S0218625X08011780

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