FORMATION OF TRIANGULAR Cu MICROCRYSTALS IN Ti/Cu/Si THIN FILMS DURING ANNEALING

Qijing Lin, Weixuan Jing, Zhuangde Jiang, Na Zhao, Zirong Wu, Chenying Wang and Shuming Yang
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Qijing Lin: Collaborative Innovation Center of High-End Manufacturing Equipment, Xi’an Jiaotong University, Xi’an 710054, P. R. China†State Key Laboratory of Mechanical Manufacturing Systems Engineering, Xi’an Jiaotong University, Xi’an 710049, P. R. China‡State Key Laboratory of Digital Manufacturing Equipment & Technology, Huazhong University of Science and Technology, Wuhan 430074, P. R. China§State Key Laboratory of Fluid Power and Mechatronic Systems, Zhejiang University, Hanzhou 310027, P. R. China
Weixuan Jing: #x2020;State Key Laboratory of Mechanical Manufacturing Systems Engineering, Xi’an Jiaotong University, Xi’an 710049, P. R. China
Zhuangde Jiang: Collaborative Innovation Center of High-End Manufacturing Equipment, Xi’an Jiaotong University, Xi’an 710054, P. R. China†State Key Laboratory of Mechanical Manufacturing Systems Engineering, Xi’an Jiaotong University, Xi’an 710049, P. R. China
Na Zhao: #x2020;State Key Laboratory of Mechanical Manufacturing Systems Engineering, Xi’an Jiaotong University, Xi’an 710049, P. R. China
Zirong Wu: #x2020;State Key Laboratory of Mechanical Manufacturing Systems Engineering, Xi’an Jiaotong University, Xi’an 710049, P. R. China
Chenying Wang: Collaborative Innovation Center of High-End Manufacturing Equipment, Xi’an Jiaotong University, Xi’an 710054, P. R. China†State Key Laboratory of Mechanical Manufacturing Systems Engineering, Xi’an Jiaotong University, Xi’an 710049, P. R. China
Shuming Yang: #x2020;State Key Laboratory of Mechanical Manufacturing Systems Engineering, Xi’an Jiaotong University, Xi’an 710049, P. R. China

Surface Review and Letters (SRL), 2018, vol. 25, issue 05, 1-5

Abstract: Sandwich stacked Ti/Cu/Si thin films were deposited on a single-side polished Si(111) substrate using DC magnetron sputtering system and annealed using a rapid thermal annealing (RTA) system. Complex dendritic patterns, whose branches are composed of Cu rods and triangular Cu microcrystals were obtained on Ti/Cu thin film annealed at 700∘C. The shape of one triangular Cu microcrystal is a truncated equilateral triangular pyramid with a flat top. Triangular Cu microcrystals grow in the number when Ti/Cu thin films are annealed at 800∘C. Experimental results show that anisotropy affects the growth of surface patterns and the top Ti capping layer works as a protection for the underlying Cu layer from oxidation.

Keywords: Triangular Cu microcrystals; dendritic patterns; thin films; microstructure; oxidation (search for similar items in EconPapers)
Date: 2018
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DOI: 10.1142/S0218625X1850097X

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