INVESTIGATION IN UFV-μ WEDM PARAMETERS OF Ni-Cr SPACE ALLOY USING RSM TECHNIQUE

M. Karthikeyan, S. Muthu Vijaya Pandian and R. Vijayakumar
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M. Karthikeyan: Anna University, Chennai 600025, Tamil Nadu, India
S. Muthu Vijaya Pandian: ��Department of Electrical and Electronics Engineering, SNS College of Technology, Coimbatore, 641035, Tamil Nadu, India
R. Vijayakumar: ��Department of Mechanical Engineering, GRT Institute of Engineering and Technology, Tiruttani, 631209, Tamil Nadu, India

Surface Review and Letters (SRL), 2023, vol. 30, issue 09, 1-20

Abstract: Ultrasonic frequency vibration coupled micro-wire electrical discharge machining (UFV-μ WEDM) has received enormous consideration due to its zero-tolerance machining. Nickel chromium (Ni–Cr) space alloys are a natural choice within the aerospace industry, which are exposed to high temperatures and high pressure, such as turbine seals and exhaust liners. This study reveals the impact of the UFV-μ WEDM influencing machining parameters like ultrasonic frequency vibration (UFV), servo voltage (VS), time on (Ton), cutting angle (AC), time off (Toff), and current (I) on the Ni–Cr space alloy in terms of minimum surface undulation (Ra) with maximum material removal rate (MRR). The cutting trials are carried out by central composite design (CCD). Analysis of variance (ANOVA) is used to find out the proportionate contribution of several factors, and it discloses that VS was the significant parameter impacting Ra (64.57%) and MRR (61.86%). The performance sequence of significant influencing parameters is VS>Toff>AC>Ton>I. According to desirability analysis (DA), optimum parameters for numerous solutions are Ton=8μs, VS=50V, Toff=14μs, I=3A, and AC=30∘. The optimum conditions lead to the highest MRR (5.72mm3/min) and the lowest Ra (3.42μm). Scanning electron, 3D topography, and atomic force microscope images are used to analyze the machined surface.

Keywords: Ni–Cr; ultrasonic; EDM; desirability; Spark; discharge; undulation; erosion (search for similar items in EconPapers)
Date: 2023
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DOI: 10.1142/S0218625X23500609

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