Optimal placement of heat sources on a rectangular grid

B. Cahlon, I.E. Schochetman and M. Shillor

Mathematics and Computers in Simulation (MATCOM), 1992, vol. 34, issue 3, 351-364

Abstract: We consider the optimal placement of thermally active electronic devices or components on a rectangular grid. These devices generate heat which is conducted to their neighbors and the edges of the board, and is exchanged with a forced convective flow of cool air. We have recently developed a model for such cooling processes, consisting of a discrete system of equations for the temperatures of the devices. We use this model in conjunction with the annealing algorithm to find the optimal placement of the devices on the board. The objective value of a given placement is measured by four different objective functions. A comparison of the results on an example is presented.

Date: 1992
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Persistent link: https://EconPapers.repec.org/RePEc:eee:matcom:v:34:y:1992:i:3:p:351-364

DOI: 10.1016/0378-4754(92)90011-5

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