EconPapers    
Economics at your fingertips  
 

Finite element simulation of thermoforming processes for polymer sheets

M.K. Warby, J.R. Whiteman, W.-G. Jiang, P. Warwick and T. Wright

Mathematics and Computers in Simulation (MATCOM), 2003, vol. 61, issue 3, 209-218

Abstract: The problem of modelling and the finite element simulation of thermoforming processes for polymeric sheets at various temperatures and for different loading regimes is addressed. In particular, the vacuum forming process for sheets at temperatures of approximately 200°C and the Niebling process for sheets at temperature of 100°C with high pressure loading are both described. Discussion is given to the assumptions made concerning the behaviour of the polymers and the physical happenings in the process in order that realistic models of the inflation part of each process may be produced. Stress–strain curves produced from experimental testing of BAYFOL® at various strain rates and temperatures are presented. A model for the elastic–plastic deformation of BAYFOL® is described and is used within the finite element framework to simulate the inflation part of the Niebling process. Numerical results for the deformation of sheets into a mould in the Niebling context are presented.

Keywords: Finite element simulation; Thermoforming process; Polymeric sheets (search for similar items in EconPapers)
Date: 2003
References: View complete reference list from CitEc
Citations:

Downloads: (external link)
http://www.sciencedirect.com/science/article/pii/S0378475402000770
Full text for ScienceDirect subscribers only

Related works:
This item may be available elsewhere in EconPapers: Search for items with the same title.

Export reference: BibTeX RIS (EndNote, ProCite, RefMan) HTML/Text

Persistent link: https://EconPapers.repec.org/RePEc:eee:matcom:v:61:y:2003:i:3:p:209-218

Access Statistics for this article

Mathematics and Computers in Simulation (MATCOM) is currently edited by Robert Beauwens

More articles in Mathematics and Computers in Simulation (MATCOM) from Elsevier
Bibliographic data for series maintained by Catherine Liu ().

 
Page updated 2025-03-19
Handle: RePEc:eee:matcom:v:61:y:2003:i:3:p:209-218