Monte Carlo simulation of electromigration phenomena in metallic lines

C. Pennetta, L. Reggiani and E. Alfinito

Mathematics and Computers in Simulation (MATCOM), 2003, vol. 62, issue 3, 495-499

Abstract: The electromigration (EM) of metallic lines is studied in terms of competition between biased processes taking place in a random resistor network. The effects associated with the transport of mass and with the consequent growth of the internal stress are accounted for by stochastic generation and recovery of voids, driven by the external current. Monte Carlo simulations enable us to successfully investigate within a unified theoretical framework a variety of relevant aspects of EM degradation. Here, we present an implementation of the model to rectangular networks. In this manner it is possible to study geometrical effects. An excellent agreement is found between the simulation results and the experimental findings concerning the dependence of the failure process upon the length of the metallic line.

Keywords: Electromigration; Resistors; Percolation (search for similar items in EconPapers)
Date: 2003
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Persistent link: https://EconPapers.repec.org/RePEc:eee:matcom:v:62:y:2003:i:3:p:495-499

DOI: 10.1016/S0378-4754(02)00221-5

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