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The matching of lead underwriters and issuing firms in the Japanese corporate bond market

Colin McKenzie and Sumiko Takaoka

Mathematics and Computers in Simulation (MATCOM), 2013, vol. 93, issue C, 86-97

Abstract: The purpose of this paper is to examine the role of reputation in the matching of lead underwriters and issuing firms in the straight corporate bond market in Japan. While the existing literature already investigates how the issuing firm chooses its lead underwriter at the time of issue, this paper uses successive issues of straight corporate bonds to examine how the matching of lead underwriters and issuing firms changes over time.

Keywords: Corporate bonds; Japan; Matching; Reputation; Underwriter (search for similar items in EconPapers)
Date: 2013
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Persistent link: https://EconPapers.repec.org/RePEc:eee:matcom:v:93:y:2013:i:c:p:86-97

DOI: 10.1016/j.matcom.2013.04.009

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