EconPapers    
Economics at your fingertips  
 

Electric field induced pattern formation in interfacial metal colloid films

I. Aharoni-Hazan, S. Efrima, M. Deutsch and D.C. Rapaport

Physica A: Statistical Mechanics and its Applications, 1993, vol. 200, issue 1, 189-199

Abstract: First results on electric field induced aggregation in a novel colloidal film are presented. The aggregate appears as a dark structure on the shiny background of the metallic colloidal film that forms at the interface between two immiscible liquids. A variety of shapes are observed, ranging from compact circular, to highly ramified dendritic ones, depending on control parameters such as voltage and chemical composition. The aggregation process was investigated for a wide range of parameters by video photography and subsequent pattern analysis, as well as by Auger spectroscopic measurements of dried samples. A new type of mechanism—a combination of electroaggregation of the colloid particles and electrodeposition of metal ions—is proposed to account for the observations.

Date: 1993
References: View complete reference list from CitEc
Citations:

Downloads: (external link)
http://www.sciencedirect.com/science/article/pii/0378437193905178
Full text for ScienceDirect subscribers only. Journal offers the option of making the article available online on Science direct for a fee of $3,000

Related works:
This item may be available elsewhere in EconPapers: Search for items with the same title.

Export reference: BibTeX RIS (EndNote, ProCite, RefMan) HTML/Text

Persistent link: https://EconPapers.repec.org/RePEc:eee:phsmap:v:200:y:1993:i:1:p:189-199

DOI: 10.1016/0378-4371(93)90517-8

Access Statistics for this article

Physica A: Statistical Mechanics and its Applications is currently edited by K. A. Dawson, J. O. Indekeu, H.E. Stanley and C. Tsallis

More articles in Physica A: Statistical Mechanics and its Applications from Elsevier
Bibliographic data for series maintained by Catherine Liu ().

 
Page updated 2025-03-19
Handle: RePEc:eee:phsmap:v:200:y:1993:i:1:p:189-199