The statistical fracture properties of spatially correlated networks

Da-Wei Lin and Zhao-Dong Ding

Physica A: Statistical Mechanics and its Applications, 2023, vol. 618, issue C

Abstract: The influences of spatially correlated disorder in microstructure strength are systematic studies in both aspects of failure behaviors and mechanical properties. For the same level of disorder, its spatial distribution has a great influence on failure dynamics and results in different stress–strain responses. The power-law distributions for avalanches and clusters no longer hold when there is a strong correlation between microscope element strength. The brittle and ductile transition is also observed with the change in the disorder’s spatial correlation. The results address the importance of the internal correlation structure of disorder and the necessity of considering correlated disorder when studying the failure of heterogeneous materials.

Keywords: Disorder; Correlation; Fracture; Avalanches; Clusters (search for similar items in EconPapers)
Date: 2023
References: View references in EconPapers View complete reference list from CitEc
Citations: View citations in EconPapers (1)

Downloads: (external link)
http://www.sciencedirect.com/science/article/pii/S0378437123002558
Full text for ScienceDirect subscribers only. Journal offers the option of making the article available online on Science direct for a fee of $3,000

Related works:
This item may be available elsewhere in EconPapers: Search for items with the same title.

Export reference: BibTeX RIS (EndNote, ProCite, RefMan) HTML/Text

Persistent link: https://EconPapers.repec.org/RePEc:eee:phsmap:v:618:y:2023:i:c:s0378437123002558

DOI: 10.1016/j.physa.2023.128700

Access Statistics for this article

Physica A: Statistical Mechanics and its Applications is currently edited by K. A. Dawson, J. O. Indekeu, H.E. Stanley and C. Tsallis

More articles in Physica A: Statistical Mechanics and its Applications from Elsevier
Bibliographic data for series maintained by Catherine Liu ().