Structural resilience evolution and vulnerability assessment of semiconductor materials supply network in the global semiconductor industry

Yu Yu, Daipeng Ma and Yong Wang

International Journal of Production Economics, 2024, vol. 270, issue C

Abstract: In the context of the complex global supply chain situation, which faces significant challenges for the sustainable development of the semiconductor industry, such as energy and resource consumption, addressing risks and resilience issues, and sustainable resource management, etc. Therefore, this paper constructs a directed weighted supply network of semiconductor materials (gallium, germanium, and silicon) from an upstream perspective within the semiconductor industry chain during the period 2013–2022, which assesses the structural resilience under steady-state scenarios and vulnerability under the impact of risk attacks, and identifies resource power and resource center countries (or regions) within this network. The results demonstrate an improvement in the structural resilience of the gallium and germanium material supply networks, accompanied by an increase in vulnerability. There is a transition from a more centralized distribution of resource power among core countries (or regions) towards a more decentralized arrangement, while resource center countries (or regions) exhibit relative stability. In contrast, the structural resilience of the silicon material supply network declines, with a slight reduction in vulnerability. The shifts in resource power and resource center status among core countries (or regions) remain relatively stable. In conclusion, this paper presents policy recommendations aimed at enhancing the resilience of the global semiconductor materials supply chain.

Keywords: Semiconductor material; Supply network; Structural resilience; Vulnerability (search for similar items in EconPapers)
Date: 2024
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Citations: View citations in EconPapers (5)

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Persistent link: https://EconPapers.repec.org/RePEc:eee:proeco:v:270:y:2024:i:c:s092552732400029x

DOI: 10.1016/j.ijpe.2024.109172

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