Thermal analysis and optimization of metal foam PCM-based heat sink for thermal management of electronic devices

Xusheng Hu, Xiaolu Gong, Feng Zhu, Xiaodong Xing, Zhongru Li and Xiaoxia Zhang

Renewable Energy, 2023, vol. 212, issue C, 227-237

Abstract: Efficient thermal management in electric devices is highly essential for ensuring the reliability and durability of electronics. This study aims to investigate the thermal performance and optimization of metal foam PCM-based heat sink for thermal management units. Different design parameters, such as PCM types (RT31, RT42, and RT55), metal foam porosities (85%, 90%, and 95%), and metal foam materials, are studied to determine heat sink optimal parameters, considering various critical temperatures: 40 °C, 50 °C, 60 °C and 70 °C. The volume-averaged method is used to simulate the heat transfer, phase change, and fluid flow within the heat sink unit. Heat transfer between PCM and metal foam is established using a thermal non-equilibrium model. The results show that the usage of metal foam is conducive to the thermal performance enhancement of heat sinks. Among the three parameters, PCM types show a considerable effect on thermal performance of heat sinks, e.g., the maximum operation time of heat sinks with RT31 is about 5 times that of heat sinks with RT55 for the critical temperature of 40 °C. Among all the cases, heat sinks using RT31 and aluminum foam perform optimally, which can achieve the optimal design of heat sinks.

Keywords: Heat sink; Phase change material; Metal foam; Thermal performance; Optimization (search for similar items in EconPapers)
Date: 2023
References: View references in EconPapers View complete reference list from CitEc
Citations: View citations in EconPapers (4)

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Persistent link: https://EconPapers.repec.org/RePEc:eee:renene:v:212:y:2023:i:c:p:227-237

DOI: 10.1016/j.renene.2023.05.021

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